Heat sink and spring clip assembly

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

174 163, 257727, H05K 720

Patent

active

058186956

ABSTRACT:
A heat sink and spring clip assembly for removing heat from an electronic module and for holding the heat sink and electronic module to a circuit board, with the heat sink having a finned top surface, and a flat bottom surface larger than the electronic module for holding the electronic module between the bottom surface and the circuit board, with the bottom surface also having a downward extending leg at each corner, each leg ending with a foot for resting on the circuit board and holding the heat sink a fixed distance above the circuit board, and the spring clip for holding the heat sink to the circuit board having a substantially rectangular frame with two opposing torsion bar sides and two opposing leaf spring sides, the sides connected at four corners, and each corner having a downward extending leg with a latching notch for latching into a latching hole in the circuit board when the spring clip is pressed down over the heat sink and the leaf spring sides are compressed.

REFERENCES:
patent: 5019940 (1991-05-01), Clemens
patent: 5208731 (1993-05-01), Blomquist
patent: 5329426 (1994-07-01), Villani
patent: 5381305 (1995-01-01), Harmon et al.
patent: 5504652 (1996-04-01), Foster et al.
patent: 5541811 (1996-07-01), Henningsson
patent: 5570271 (1996-10-01), Lavochkin
patent: 5586005 (1996-12-01), Cipolla
patent: 5699229 (1997-12-01), Brownell

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