Heat sink and retainer for electronic integrated devices

Details Heat sink and retainer for electronic integrated devices Heat sink and retainer for electronic integrated devices

1999-12-29

2001-08-14

Atkinson, Christopher (Department: 3743)

Heat exchange

Heat transmitter

C165S080300

Reexamination Certificate

active

06273185

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat sink assembly, and particularly to an easily assembled and low cost heat sink.
2. Description of Prior Art
Since the successful introduction of integrated circuits devices, there has been a steady progression toward larger IC devices to permit inclusion of a greater number of functions of the devices. The result is that quantity of heat produced by these larger semiconductor devices is getting larger and larger. To effectively dissipate the produced heat, heat sinks are used. To firmly attach the heat sinks to the IC devices, retainers are used. Examples of prior art heat sinks and retainers are disclosed in Taiwan patent application Nos. 83218644, and 85200861. Referring to
FIG. 4
, there is shown a printed circuit board (PCB)
60
on which a substrate
61
and a chip
64
is mounted. Two apertures
62
are defined in the PCB
60
. A conventional heat sink
50
includes a plate
51
with a large number of integral fins
53
thereon. A pair of protrusion tabs
52
is provided on opposite angles of the plate
51
and each has an aperture
54
. A pair of retainers
40
is formed by plastic injection molding. Each retainer
40
has a shape of a nail with a stem
42
having a pair of barbs
44
at a lower end thereof. A pair of helical springs
46
is provided for providing an elastic force to firmly attach the heat sink
50
to the chip
64
. In assembly, the retainers
40
are extended through the springs, the aperture
54
in the tabs
52
, and the apertures
62
in the PCB
60
to reach a position in which the barbs
44
engage a bottom face of the PCB
60
, the springs
46
being compressed between the tabs
52
and heads (not labeled) of the retainers
40
thereby pushing the heat sink
50
downwardly to cause the heat sink
50
to closely engage with the chip
64
.
To retain the heat sink on the chip, the prior art needs four components, i.e., two retainers
40
and two helical springs
46
, which cause the inventory to be complicated and costly. Furthermore, the helical springs
46
are expensive components, which cause the whole cost of the heat sink assembly to be high. Hence, an improved electrical connector is required to overcome the disadvantages of the prior art.
SUMMARY OF THE INVENTION
A first object of the present invention is to provide an easily assembled and low cost heat sink with retainers.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.
A heat sink assembly comprises a heat sink and a pair of retainers. The heat sink includes a plate with a flat bottom surface for abutting against an upper face of a chip and has a large number of fins that are integral with the plate. A locking protrusion is formed at a proper position of each sidewall of the plate. A pair of retainers each comprises a transition portion, two engaging arms perpendicular to each other, and a nail downwardly extending from the transition portion. Each engaging arm extends from the transition portion and slightly slops downwardly therefrom. A rectangular sheath is provided on a distal end of each engaging arm remote from the transition portion, and defines a channel having a shape in conformity to a profile of the locking protrusion so that the sheath can fittingly engage with the locking protrusion. The nail includes a main body, a neck section, a protruding section and a cone section. A slot is defined through a lower part of the neck section and through the protruding section and the cone section to create two bifurcated legs so that a lower end portion of the nail will have good resilience, allowing it to extend through a PCB and lock therewith.


REFERENCES:
patent: 5155661 (1992-10-01), Nagesh et al.
patent: 5367433 (1994-11-01), Blomquist
patent: 5377745 (1995-01-01), Hsieh
patent: 5423375 (1995-06-01), Chiou
patent: 5504652 (1996-04-01), Foster et al.
patent: 5541811 (1996-07-01), Henningsson et al.
patent: 5748446 (1998-05-01), Feightner et al.
patent: 5886870 (1999-03-01), Omori
patent: 5999406 (1999-12-01), McKain et al.
patent: 6037660 (2000-03-01), Liu

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