Heat sink and printed circuit board combination

Details Heat sink and printed circuit board combination Heat sink and printed circuit board combination

1995-08-21

1996-08-20

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, H05K 100

Patent

active

055480900

ABSTRACT:
A heat conductor has a plurality of resilient elongate elements, each being connected to a surrounding base of the conductor through two neck portions and being pivoted about its common axis. Two end portions of each elongate element are curved. When the heat conductor is mounted on a heat sink which is held over a plurality of electronic components mounted upon a printed circuit board, the curved end portions contact both the components and the heat sink with an appropriate pressure, because of the torsional action of the neck portions. The elongate elements provide short thermal paths to directly conduct the heat generated by the components to the heat sink.

REFERENCES:
patent: 4707726 (1987-11-01), Tinder
patent: 4887147 (1989-12-01), Friedman
patent: 4888637 (1989-12-01), Sway Tin et al.
patent: 5050040 (1991-09-01), Gondsky et al.
patent: 5155661 (1992-10-01), Nagesh et al.
patent: 5306866 (1994-04-01), Gruber et al.
patent: 5315480 (1994-05-01), Samarov et al.
patent: 5390078 (1995-02-01), Taylor

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