Heat sink and package surface design

Details Heat sink and package surface design Heat sink and package surface design

2005-03-22

2005-03-22

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S719000, C257S706000, C257S717000, C165S080300, C165S185000

Reexamination Certificate

active

06870736

ABSTRACT:
An electronic assembly that includes a heat sink, a thermal interface material, integrated circuit, and a package connected to the integrated circuit. The thermal interface material is positioned between a first surface on the package and a second surface on the heat sink to improve thermal conductivity between the package and heat sink. At least one of the first and second surfaces includes either a cavity that traps excess thermal interface material when the heat sink is compressed against the package.

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