Heat sink and multi mount pad lead frame package and method for

Details Heat sink and multi mount pad lead frame package and method for Heat sink and multi mount pad lead frame package and method for

1990-06-26

1991-09-17

Wojciechowicz, Edward J.

357 69, 357 81, H01L 2348

Patent

active

050499734

ABSTRACT:
A packaging assembly for electrical components includes a heat sink having a mounting surface upon which certain ones of the electrical components are mounted. An associated lead frame is rigidly secured to an edge of the heat sink, and one or more extended ends of selected leads thereof are formed into mounting pads positioned over the mounting surface of the heat sink for receiving other ones of the electrical components. Dielectric material is positioned between the mounting pads and the heat sink, for electrically isolating the electrical components mounted upon the mounting pads from one another and from electrical components mounted directly on the heat sink. The electrical components and proximate ends of the leads of the lead frame are electrically interconnected via electrical conductors, and the assembly is encapsulated with a plastic material about the heat sink and proximate ends of the lead frame, whereafter bridge elements between the leads of the lead frame are severed.

REFERENCES:
patent: 3569797 (1971-03-01), Simmons
patent: 3893158 (1975-07-01), Lincoln
patent: 4003544 (1977-01-01), Bliven et al.
patent: 4114177 (1978-12-01), King
patent: 4446375 (1984-05-01), Aird
patent: 4556896 (1985-12-01), Meddles
patent: 4633582 (1987-01-01), Ching et al.
patent: 4740868 (1988-04-01), Hawkins
patent: 4783428 (1988-11-01), Kalfus
patent: 4807018 (1989-02-01), Cellai
patent: 4984065 (1991-01-01), Sako

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