Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-10-16
1999-09-14
Thompson, Gregory
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257719, H05K 720
Patent
active
059532084
ABSTRACT:
A structure for mounting a heat sink onto an integrated circuit package mounted on a printed circuit board is constructed such that a guide member having a frame portion and support post portions is fixed to the printed circuit board, and the heat sink is seated on an inner periphery of the guide member such that the heat sink may be closely contacted with the integrated circuit package, and then a cover is fixed to the guide member such that it covers over outer peripheral edge portions of an upper face of the heat sink. This structure is high in cooling efficiency and is easy to mount.
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Research Disclosure, No. 318, Oct. 1990, Havant GB, p. 851 `Spring-Loaded Heat Sinks for VLSI Packages`.
Fujitsu Limited
Thompson Gregory
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