Heat sink and method of manufacturing the same

Details Heat sink and method of manufacturing the same Heat sink and method of manufacturing the same

2011-03-01

2011-03-01

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S707000, C361S709000, C361S717000, C361S719000, C165S080300, C165S185000, C029S890100

Reexamination Certificate

active

07898809

ABSTRACT:
A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture.

REFERENCES:
patent: 6088917 (2000-07-01), Lee et al.
patent: 6230789 (2001-05-01), Pei et al.
patent: 6390182 (2002-05-01), Sauer
patent: 7330355 (2008-02-01), Kuo et al.
patent: 2005/0065581 (2005-03-01), Fletcher et al.
patent: 2007/0102142 (2007-05-01), Reis et al.

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