Heat sink and method of fabricating

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Powder pretreatment

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419 44, 419 47, 419 48, 419 54, 419 55, B22F 314

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active

055230490

ABSTRACT:
A heat sink composed of thermally conductive particles dispersed in a monolithic structure having a continuous microstructure; and the method of forming a heat sink by molding the heat sink from a thermoplastic or epoxy material which has been filled with thermally conductive particles, debinding the molded heat sink and densifying the debound heat sink into a monolithic structure.

REFERENCES:
patent: 5028367 (1991-07-01), Wei
patent: 5045972 (1991-09-01), Supan
patent: 5366688 (1994-11-01), Terpstra et al.
S. L. Spitz, EP&E, Feb. 1991, Conductive Polymers Come Out from the Labs, pp. 64-68.

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