Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
Patent
1990-11-15
1992-04-21
Jones, W. Gary
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Presses or press platen structures, per se
156298, 156541, 156580, 156581, B30B 502
Patent
active
051064510
ABSTRACT:
An apparatus and method for removably mounting heat sinks on a chip carrying substrate by simultaneously applying pressure to both the heat sinks and the substrate. Also disclosed is a three dimensional heat sink having a plurality of spatially interconnected holes formed therein. The holes act as extended boiling surfaces which also promote agitation induced by bubble motion.
REFERENCES:
patent: 1806861 (1931-05-01), Owen
patent: 3533352 (1970-10-01), Miller
patent: 3964958 (1976-06-01), Johnston
patent: 3971435 (1976-07-01), Peck
patent: 4092697 (1978-05-01), Spaight
patent: 4203129 (1980-05-01), Oktay et al.
patent: 4619316 (1985-04-01), Nakayama et al.
patent: 4620216 (1986-06-01), Horvath
patent: 4653163 (1987-03-01), Kuwahara et al.
patent: 4686606 (1987-08-01), Yamada et al.
patent: 4694323 (1987-09-01), Itahana et al.
patent: 4737228 (1988-04-01), Bridgland
patent: 4826593 (1984-05-01), Nev
IBM Technical Disclosure Bulletin, vol. 31, No. 3, Aug. 1988, "Testable High Performance Module", by Katyl et al., pp. 158-160, Letter to Yakubowski dated Jun. 13, 1988, re: Pyralux.
Research Disclosure #28852, Apr. 1988, "Heat Sink Having High Ratio Fluid Channels . . . Manufacture", p. 224.
IBM Technical Disclosure Bulletin, vol. 23, No. 8, pp. 3623-3624, Jan. 1981, "Fixture for . . . Module" by E. Kunkler et al.
IBM Technical Disclosure Bulletin, vol. 22, No. 6, pp. 2297-2298, Nov. 1979, "Heat Sink Design . . . Environment" by Arnold et al.
IBM Technical Disclosure Bulletin, vol. 19, No. 5, p. 1640, Oct. 1976, "Pressure-Sensitive Tape . . . Application" by Christie et al.
Kan John C.
Yakubowski Carl
International Business Machines - Corporation
Jones W. Gary
Ludwin Richard M.
Reifsnyder David
LandOfFree
Heat sink and method of attachment does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sink and method of attachment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink and method of attachment will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1583475