Heat sink and method for removing heat from a plurality of compo

Details Heat sink and method for removing heat from a plurality of compo Heat sink and method for removing heat from a plurality of compo

1998-06-18

1999-08-17

Atkinson, Christopher

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

16510414, 165135, 361700, 257715, F28D 1500

Patent

active

059379375

ABSTRACT:
The heat sink has an interior and has a first exterior surface and a second exterior surface, and includes a first heat removal region disposed in the interior. The first heat removal region defines a first cavity and is at least partially filled with a liquid. The first heat removal region transfers a first amount of heat from a first electronic device via a pool boiling phenomenon when the first electronic device is disposed on the first exterior surface. A first conduction-inhibiting region is disposed proximate the first cavity. A second heat removal region is disposed in the interior. The second heat removal region defines a second cavity and is at least partially filled with the liquid. The second heat removal region transfers a second amount of heat from a second electronic device via the pool boiling phenomenon when the second electronic device is disposed on the first exterior surface.

REFERENCES:
patent: 3579821 (1971-05-01), Kurisu
patent: 4133376 (1979-01-01), Eilenberg et al.
patent: 4137964 (1979-02-01), Buckley
patent: 4941530 (1990-07-01), Crowe
patent: 5161609 (1992-11-01), Dutertre et al.

Affiliated with

Also associated with

Rating

Heat sink and method for removing heat from a plurality of compo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink and method for removing heat from a plurality of compo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink and method for removing heat from a plurality of compo will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-305469