Heat sink and method for its production

Details Heat sink and method for its production Heat sink and method for its production

2007-01-09

2007-01-09

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S708000, C361S709000, C361S710000, C257S712000, C257S737000, C228S123100, C228S180220

Reexamination Certificate

active

10938573

ABSTRACT:
The present invention provides a liquid-cooling type heat sink which has a high pressure-resistibility and is resistible against the corrosion or erosion-corrosion or electrolytic etching, and a method for its production.The heat sink of the present invention comprises plural base members21, 31and41,the base member being each in plate or block-shape, the base member each having paths60shaped on one or both sides of surfaces thereof, and the base members being bonded to each other, wherein a communicating flow path60aincluding path60,through holes61, 62,and63,is formed for a cooling medium to flow in and out. The base members are bonded to each other with a solder layer54made of Au—Sn alloy or Sn, while a coating layer of Au53is formed on each of the inner surfaces of the bonded base members. At the time of making a bond between the base members, the coating layer of Au53and the solder layer54are diffused to each other, resulting in formation of a bond layer of alloy55containing at least 91 wt % of Au and at most 9 wt % of Sn.

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