Heat sink and high thermal stability structure for CPP sensor

Details Heat sink and high thermal stability structure for CPP sensor Heat sink and high thermal stability structure for CPP sensor

2007-04-24

2007-04-24

Miller, Brian E. (Department: 2627)

Dynamic magnetic information storage or retrieval

Head

Magnetoresistive reproducing head

C360S320000

Reexamination Certificate

active

10878821

ABSTRACT:
A currently perpendicular to plane (CPP) sensor having a heat sink structure disposed beyond the stripe height of the sensor. The heat sink is preferably in thermal contact with one of the shields/leads of the sensor while being electrically insulated from the other shield/lead.

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patent: 6754055 (2004-06-01), Ono et al.
patent: 2002/0154451 (2002-10-01), Dimitrov et al.
patent: 2002/0154456 (2002-10-01), Carey et al.

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