Heat sink and Faraday Cage assembly for a semiconductor module a

Details Heat sink and Faraday Cage assembly for a semiconductor module a Heat sink and Faraday Cage assembly for a semiconductor module a

1997-07-30

1999-05-04

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361683, 361704, 361713, 361818, 257707, 257714, 174 35R, 165 802, H05K 720

Patent

active

059010401

ABSTRACT:
The invention is a heat sink assembly for the removal of heat from semiconductor and power converter modules. The packaging design for semiconductor modules and power converter modules provides efficient heat removal and a tight Faraday Cage. There is a heat transfer layer sandwiched between a CPU module and a power converter module. The heat sink assembly includes a heat transfer layer, a fin stack, and a series of heat pipes. The heat transfer layer has a slot for passage of power cables and sense lines which connects both the CPU module and the power converter module, and the power converter module and the printed circuit board. The heat sink chamber also serves as a Faraday Cage and thus attenuates EMI from the semiconductor module, the power converter module, the power cables, and the sense lines.

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