Heat sink and fan arrangement

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

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Details

C361S697000, C361S704000

Reexamination Certificate

active

06308773

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates to a heat sink and fan arrangement and, more particularly, to such a heat sink and fan arrangement, which uses two U-shaped, hook-tip binding wires to secure the fan to the heat sink.
Various heat sinks have been disclosed for use with a fan to dissipate heat from an electronic device, for example, a CPU (central processing unit).
FIG. 6
shows a heat sink and fan arrangement for use to dissipate heat from a CPU. This arrangement comprises a heat sink adapted for attaching to the top sidewall of the CPU, a fan adapted for mounting on the heat sink at the topside, and a fan case adapted for fastening to the CPU to secure the fan, the heat sink and the CPU together. The fan case has bottom hooks adapted for hooking on the bottom sidewall of the CPU. This arrangement is functional, however the manufacturing cost of the fan case is high. Further, the fan case fits only a particular model of CPU.
SUMMARY OF THE INVENTION
The present invention has been accomplished to provide a heat sink and fan arrangement, which eliminates the aforesaid drawbacks. It is one object of the present invention to provide a heat sink and fan arrangement, which is inexpensive to manufacture. It is another object of the present invention to provide a heat sink and fan arrangement, which fits any of a variety of electronic devices. According to the present invention, two resilient binding wires are used and hooked in four through holes in four corners of the fan to secure the fan to the heat sink.


REFERENCES:
patent: 5509465 (1996-04-01), Lai
patent: 5678627 (1997-10-01), Lee

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