Heat sink and electromagnetic interference shield assembly

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding

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Details

257491, 257503, 361767, H01L 2504, H01L 3902

Patent

active

054593484

ABSTRACT:
The present invention provides a heat sink and electromagnetic interference shield assembly for a plurality of semiconductor elements. The semiconductor elements are connected with other circuit elements to form an electrical circuit. Each semiconductor element has a metal portion for dissipating heat generated by the semiconductor element. The metal portion also emits electrical energy as a result of the operation of the semiconductor element thereby causing unwanted electromagnetic interference. The assembly comprises an insulator attached to the meted portion of the semiconductor element and a substrate for mounting the plurality of semiconductor elements. The insulator is of a thermally conductive material to facilitate the conduction of thermal energy away from the semiconductor element. The substrate has a metal base layer, a middle insulating layer, and a plurality of metal mounting areas for mounting the plurality of semiconductor elements. The electrical energy emitted by each semiconductor element is capacitively coupled to its corresponding metal mounting area. The assembly also contains a conductive path for returning the electrical energy coupled to the metal mounting area to one of the circuit elements such that the amount of electromagnetic interference is reduced.

REFERENCES:
patent: 3912849 (1975-10-01), Thomas
patent: 4589057 (1986-05-01), Short
patent: 4648008 (1987-03-01), Neyroud et al.
patent: 4736266 (1988-04-01), Tanibe
patent: 4739448 (1988-04-01), Rowe et al.
patent: 4788627 (1988-11-01), Ehlert et al.
patent: 4819042 (1989-04-01), Kaufman
patent: 4879633 (1989-11-01), Kaufman
patent: 4901137 (1990-02-01), Sato et al.
patent: 4905123 (1990-02-01), Windle et al.
patent: 4965659 (1990-10-01), Sasame et al.
patent: 4965660 (1990-10-01), Ogihara et al.
patent: 4965710 (1990-10-01), Pelly et al.
patent: 5019941 (1991-05-01), Craft
patent: 5045642 (1991-09-01), Ohta et al.
patent: 5050038 (1991-09-01), Malaurie et al.
patent: 5077595 (1991-12-01), Fakunaga

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