Heat sink and display panel including heat sink

Details Heat sink and display panel including heat sink Heat sink and display panel including heat sink

2007-08-14

2007-08-14

Tran, Long K. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S717000, C257SE23051, C438S122000

Reexamination Certificate

active

11504635

ABSTRACT:
A heat sink that absorbs heat generated from at least one semiconductor device and dissipates the heat absorbed includes: a first surface adapted to match and contact at least one semiconductor device; a second surface having a fin structure adapted to dissipate heat from the heat sink into the air, the second surface arranged opposite to the first surface; combining portions having combining apertures each adapted to receive a predetermined combining element to affix the at least one semiconductor device to the heat sink, the combining apertures being arranged through the first surface and the second surface; and a protrusion arranged at a location of the first surface matching a point on an upper portion of the at least one semiconductor device; wherein the protrusion stops the at least one semiconductor device from rotating upon the at least one semiconductor device being affixed to the first surface of the heat sink by the combining element.

REFERENCES:
patent: 4199654 (1980-04-01), DeRoss
patent: 5661342 (1997-08-01), Kawamoto
patent: 6255722 (2001-07-01), Ewer et al.
patent: 6404065 (2002-06-01), Choi
patent: 87-11291 (1987-07-01), None
patent: 91-3771 (1991-02-01), None
patent: 91-3771 (2002-02-01), None

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