Heat sink and cover for tab integrated circuits

Details Heat sink and cover for tab integrated circuits Heat sink and cover for tab integrated circuits

1992-10-09

1994-01-18

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257706, 257722, 257718, 361702, H05K 720

Patent

active

052804097

ABSTRACT:
An apparatus providing a heat sink and protective cover for a Tape Automated Bonding ("TAB") integrated circuit mounted on a printed circuit board. The apparatus is comprised of a printed circuit board with a plurality of thermal vias drilled through it. The TAB integrated circuit is mounted on the printed circuit board over the thermal vias. The vias draw then heat generated by the TAB integrated circuit to the other side of the printed circuit board. A heat sink is then placed over the thermal vias on the opposite side of the board to dissipate the heat. The heat sink is held in place by a spring clip which hooks onto a molded plastic cover placed over the TAB integrated circuit. The apparatus is easy to manufacture and efficiently dissipates the heat generated by TAB integrated circuits.

REFERENCES:
patent: 4030001 (1977-06-01), Medley, Jr. et al.
patent: 4660123 (1987-04-01), Hermann
patent: 4739448 (1988-04-01), Rowe et al.
patent: 4867235 (1989-09-01), Grapes et al.
patent: 4924352 (1990-05-01), Septfons
patent: 4959900 (1990-10-01), de Givry et al.
patent: 5050040 (1991-09-01), Gondusky et al.
patent: 5099550 (1992-03-01), Beane et al.
patent: 5113315 (1992-05-01), Capp et al.
patent: 5168425 (1992-12-01), Radack, Jr.
IBM, "IBM Technical Disclosure Bulletin" vol. 14, No. 11, Apr. 1972, Replaceable Chip to Heat Sink Connection on Circuit Boards.
IBM, "IBM Technical Disclosure Bulletin" vol. 31, No. 6, Nov. 1988, Heat Sink Assembly for TAB-Mounted Devices, p. 372.

Affiliated with

Also associated with

Rating

Heat sink and cover for tab integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink and cover for tab integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink and cover for tab integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1140373