Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-09-04
2007-09-04
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C361S719000, C165S080100, C165S080300, C174S016100, C174S016300
Reexamination Certificate
active
11025638
ABSTRACT:
A heat sink and component support assembly that includes a core structure (110). The core structure (110) includes: a central member (112) having first (114, 116) and second opposing sides; at least one heat dissipating surface (124, 126, 128) extending from at least one of the first opposing sides (114, 116); and first and second extension members (118, 120) positioned adjacent to each of the second opposing sides. The assembly may also include an airflow facilitating arrangement, such as a fan (184), positioned adjacent to the core structure (110) for further enhanced heat dissipating capabilities.
REFERENCES:
patent: 5218516 (1993-06-01), Collins et al.
patent: 6046921 (2000-04-01), Tracewell
patent: 6151215 (2000-11-01), Hoffman
patent: 6434005 (2002-08-01), Vinciarelli
patent: 6477053 (2002-11-01), Zeidan
patent: 6493227 (2002-12-01), Nielsen
patent: 6515858 (2003-02-01), Rodriguez
patent: 6538889 (2003-03-01), Barsun et al.
patent: 6921328 (2005-07-01), Nohara
patent: 7068510 (2006-06-01), Crippen et al.
patent: 7113405 (2006-09-01), Armstrong et al.
patent: 2004/0037040 (2004-02-01), Yu et al.
patent: 2004/0190249 (2004-09-01), Hasegawa
patent: 2004/0218367 (2004-11-01), Lin et al.
Turocy James W.
Walter Peter P.
Widmayer Robert B.
Chervinsky Boris
Davis Valerie M.
Motorola Inc.
LandOfFree
Heat sink and component support assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sink and component support assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink and component support assembly will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3742686