Heat sink and circuit enclosure for high power electronic circui

Details Heat sink and circuit enclosure for high power electronic circui Heat sink and circuit enclosure for high power electronic circui

1996-08-27

1998-05-05

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 165185, 361721, H05K 720

Patent

active

057484457

ABSTRACT:
This invention describes a triangular heat sink and circuit enclosure for high power dissipation electronic circuits. The heat sink uses a number of cooling fins to provide cooling of the circuitry and equipment contained in the circuit enclosure and can handle power dissipation levels of up to 15 kilowatts. The circuit enclosure uses air moving devices and triangular heat sinks to provide both conduction cooling and heat transfer to a stream of air. The cooling fins of the heat sink are sealed away from the electronic components when the circuit enclosure is assembled.

REFERENCES:
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patent: 5132780 (1992-07-01), Higgins, III
patent: 5170336 (1992-12-01), Getter et al.
patent: 5297025 (1994-03-01), Shoquist
patent: 5311928 (1994-05-01), Martin
patent: 5406451 (1995-04-01), Korinsky

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