Heat sink and attachment process for electronic components

Details Heat sink and attachment process for electronic components Heat sink and attachment process for electronic components

1997-09-16

1999-06-29

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361704, 361697, 165 803, 165 804, 257727, 174 163, 439 64, 439 70, H05K 720

Patent

active

059177004

ABSTRACT:
A clip assembly and method of attachment for a heat sink having a pin-fin array employing thermally conducting tape to secure the heat sink to a heat dissipating BGA component together with at least one clip assembly which is secured to the underside of the component at its edges.

REFERENCES:
patent: 5371652 (1994-12-01), Clemens et al.
patent: 5448449 (1995-09-01), Bright et al.
patent: 5594624 (1997-01-01), Clemens et al.

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