Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-09-01
2010-06-29
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S707000, C361S719000, C174S015200, C257S715000, C165S080400, C165S104260
Reexamination Certificate
active
07746642
ABSTRACT:
A heat sink for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a protrusion projecting downwardly therefrom. A bottom surface of the protrusion is milled to be flat and smooth, whereby the bottom surface can intimately contact the electronic component. A method for manufacturing the heat sink comprising milling a bottom surface of a protrusion punched downwardly from a lower plate, whereby the bottom surface can be flat and smooth sufficiently to have an intimate contact with an electronic component, and sequentially welding an upper plate on the lower plate and a plurality of fins on the lower plate and the upper plate, respectively.
REFERENCES:
patent: 6397941 (2002-06-01), McCullough
patent: 7278470 (2007-10-01), Xia et al.
patent: 7343962 (2008-03-01), Xia et al.
patent: 7443680 (2008-10-01), Peng et al.
patent: 7447035 (2008-11-01), Liu et al.
patent: 7493939 (2009-02-01), Xia et al.
patent: 7495920 (2009-02-01), Chen et al.
patent: 7520316 (2009-04-01), Xia et al.
patent: 7576986 (2009-08-01), Chou et al.
patent: 2007/0188995 (2007-08-01), Franz et al.
patent: 2008/0055855 (2008-03-01), Kamath et al.
patent: 2008/0128118 (2008-06-01), Chen et al.
patent: 2009/0159252 (2009-06-01), Lai et al.
Lai Cheng-Tien
Lai Chi-Yuan
Zhou Zhi-Yong
Chervinsky Boris L
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Niranjan Frank R.
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