Heat sink

Details Heat sink Heat sink

2005-11-29

2005-11-29

Duong, Tho (Department: 3743)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S080300

Reexamination Certificate

active

06968890

ABSTRACT:
In one exemplary embodiment of the present invention, a heat sink having an embedded heat pipe and fins attached to opposite sides of the base plate. In an alternative embodiment, the base plate includes a main heat pipe and auxiliary heat pipes coupled to the main heat pipe. The fins are aligned with the auxiliary heat pipes.

REFERENCES:
patent: 4588023 (1986-05-01), Munekawa
patent: 5038858 (1991-08-01), Jordan et al.
patent: 5329993 (1994-07-01), Ettehadieh
patent: 6397941 (2002-06-01), McCullough
patent: 6407922 (2002-06-01), Eckblad et al.
patent: 6424528 (2002-07-01), Chao
patent: 6466441 (2002-10-01), Suzuki
patent: 6633484 (2003-10-01), Lee et al.
patent: 6666260 (2003-12-01), Tantoush
patent: 55065891 (1980-05-01), None
“Therma-Loop ™:Loop Heat Pipes and Loop Thermosyphons” product description, from http://www.thermacore.com/thermaloop.htm printed from internet Jun. 8, 2005 pp. 1-4.
“037862 (superceded by 037888) P4 4-U High Perfomance Heat Sink for Use With the Pentium 4 Processor ™”(423 Pin, Xeon, Foster, Prestonia, Gallatin) product description, from http://www.aavidthermalloy.com/products/microp/037862 4u.shtml printed from internet Jun. 8, 2005 pp. 1-2.
“Therma-Tower TM” product decription, from http://www.thermacore.com/therma tower.htm printed from internet Jun. 8, 2005 pp. 1-2.

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