Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
2008-03-18
2008-03-18
Tapolcai, William E. (Department: 3744)
Heat exchange
With retainer for removable article
Electrical component
C062S259200, C361S697000
Reexamination Certificate
active
07343962
ABSTRACT:
A heat sink for dissipating heat from an electronic component comprises a heat spreader and a plurality of first fins and second fins provided thereon. The first and second fins are parallel to each other and arranged in alternating order so as to define a plurality of air passages. The first and second fins are so arranged that thinner air passages and denser fin distribution in the middle along the extension direction of the air passages and wider air passages and lower fin distribution density at two ends are provided.
REFERENCES:
patent: 5959837 (1999-09-01), Yu
patent: 5991154 (1999-11-01), Clemens et al.
patent: 6031720 (2000-02-01), Crane et al.
patent: 6062301 (2000-05-01), Lu
patent: 6076594 (2000-06-01), Kuo
patent: 6097597 (2000-08-01), Kobayashi
patent: 6226178 (2001-05-01), Broder et al.
patent: 6287136 (2001-09-01), Deutsch
patent: 6301779 (2001-10-01), Azar
patent: 6351382 (2002-02-01), Nakanishi et al.
patent: 6625021 (2003-09-01), Lofland et al.
patent: 6639802 (2003-10-01), Dong et al.
patent: 6717811 (2004-04-01), Lo et al.
patent: 6909608 (2005-06-01), Fan
patent: 6935419 (2005-08-01), Malone et al.
patent: 6937474 (2005-08-01), Lee
patent: 6958915 (2005-10-01), Wang et al.
patent: 6959755 (2005-11-01), Chen
patent: 6977814 (2005-12-01), Hornung
patent: 7028758 (2006-04-01), Sheng et al.
patent: 7044197 (2006-05-01), Lee et al.
patent: 7073568 (2006-07-01), Chen et al.
patent: 7102890 (2006-09-01), Lee et al.
patent: 2004/0066628 (2004-04-01), Liu
patent: 2005/0225946 (2005-10-01), Fan et al.
patent: 2005/0257532 (2005-11-01), Ikeda et al.
patent: 2005/0286232 (2005-12-01), Chen et al.
patent: 2339963 (1999-09-01), None
patent: 2720626 (2005-08-01), None
patent: 572582 (2004-01-01), None
Li Tao
Xia Wan-Lin
Xiao Min-Qi
Zhong Yong
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Knapp Jeffrey T.
Tapolcai William E.
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