Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-10-31
2001-11-27
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S710000, C257S706000, C257S707000, C257S722000, C174S016300, C165S080300
Reexamination Certificate
active
06324061
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat sink mounted on a heat-radiating surface of a heat-producing electronic component such as a CPU or Peltier elements for absorbing and radiating heat into air.
2. Explanations of the Prior Art
Conventional heat sink is manufactured by extrusion molding of aluminum.
Drawbacks are thus involved. Not only the cooling fins cannot be set to be high but also intervals thereof cannot be narrowed. As a result, it is impossible to improve heat radiation effects.
Another drawback is that the electronic component tends to be broken and damaged owing to the difference in thermal expansion coefficients of the heat-radiating surface and the heat sink when the conventional heat sink is adhered on the heat-radiating surface of the electronic component by an adhesive.
Generally, the heat-radiating surface of an electronic component has subtle swells though it appears to be flat at a glance. Accordingly, when the heat sink is mounted on the heat-radiating surface of an electric component, there is a clearance between the heat-radiating surface and the heat sink. As a result, the heat-radiation effects of the heat sink are deteriorated.
SUMMARY OF THE INVENTION
The object of the present invention is to solve the above-described drawbacks presented in conventional heat sink.
It is another object of the present invention to provide a heat sink that has high heat-radiation effects, that is free of problems of cracks in electronic components owing to differences in thermal expansion coefficients, and that may be easily manufactured.
For this purpose, the heat sink of the present invention comprises a plurality of cooling fins each formed to assume a shape of letter L by bending a lower end of a metallic plate so that these bent portions serve as heat-collecting portions, and a plurality of spacers provided between adjoining cooling fins for maintaining intervals between the cooling fins and for pressing the heat-collecting portions of the cooling fins to a heat-radiating surface of an electronic component, wherein the cooling fins and spacers are connected by connecting rods piercing through portions at which the fins and spacers are overlapped.
With this arrangement, even in the presence of swells in the heat-radiating surface of the electronic component, the heat sink can deform in correspondence to the condition of the heat-radiating surface so as to conform to the heat-radiating surface so that the heat-collecting portions of the cooling fins are fitted along the heat-radiating surface of the electronic component.
It is preferable to form projections in the heat-radiating portions of the cooling fins.
With the projections in the heat-radiating portions of the cooling fins, not only can the heat-radiating effects be improved by the increased contact surfaces with air but also the intervals between the cooling fins can be maintained consistently even when warping deformation occurs in the cooling fins by heat.
In addition, it is preferable to form convex portions on surfaces of the spacers and to form holes in the cooling fins at portions corresponding to the convex portions so that the convex portions of the spacers are fitted in the holes of the cooling fins.
With this arrangement, the spacers and the cooling fins are fixed to each other such that the pressing force applied on the spacers is further applied onto the cooling fins. As a result, the heat-collecting portions of the cooling fins are more effectively fitted along the heat-radiating surface of the electronic component.
In the present invention, the spacers are pressed toward the electronic component side by means of mounting tools with an elastic member interposed in between, so that the heat-collecting portions of the cooling fins are fitted along the heat-radiating surface of the electronic component.
With this arrangement, the pressing force is evenly applied on each one of the spacers, and the heat-collecting portions of the cooling fins are evenly fitted along the heat-radiating surface of the electronic component.
In the present invention, an elastic member is provided below the connecting rods. In this structure, the mounting tools press the spacers with the elastic member interposed in between by pressing the connecting rods with the mounting tools, so that the heat-collecting portions of the cooling fin are fitted to the heat-radiating surface of the electronic component.
With this arrangement, the pressing force is evenly applied on each one of the spacers, and the heat-collecting portions of the cooling fins are well fitted to the heat-radiating surface of the electronic component.
REFERENCES:
patent: D. 426195 (2000-06-01), Kuo
patent: 4009752 (1977-03-01), Wilson
patent: 5558155 (1996-09-01), Ito
patent: 6104609 (2000-08-01), Chen
patent: 408195452-A (1996-07-01), None
Kinoshita Joji
Kinoshita Takahiro
Chervinsky Boris L.
Koda & Androlia
Tolin Gerald
Yamato Corporation
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