Heat exchange – Flexible envelope or cover type
Reexamination Certificate
2000-03-14
2001-05-15
Atkinson, Christopher (Department: 3743)
Heat exchange
Flexible envelope or cover type
C165S104330, C165S104320, C165S104140, C174S016300, C257S715000, C361S700000
Reexamination Certificate
active
06230788
ABSTRACT:
THIS INVENTION relates to a heat sink and more particularly to a heat sink for cooling a heat source such as electronic components mounted on a printed circuit board.
The trend in the development of electronic devices is for heat generating components to be assembled in high packaging densities on printed circuit boards (PCBs). Therefore, the heat to be dissipated at both component and PCB levels has increased tremendously and conventional free or forced air convection cooling techniques have reached their maximum cooling capacity. Since the external surfaces of heat generating components mounted on a PCB are not always in the same plane, cooling all the components on a PCB by a single solid heat sink, such as a heat pipe, is very difficult.
Heat sinks with flexible surfaces have been proposed. The main objective for such heat sinks is to cool individual electronic components. Heat sinks incorporating flexible containers for cooling multiple electronic components have also been proposed. However, the cooling capacities of such designs are limited since no effective method has been proposed for dissipating the heat absorbed by a liquid inside the flexible container.
It is an object of the present invention to provide an improved method for cooling heat generating electronic components mounted on PCBs.
Accordingly, the present invention provides a heat sink comprising: a body having an envelope including a flexible portion for thermal contact with a heat source, the envelope being filled with a thermally conductive liquid; and a thermosyphon having one end disposed at least partly within the liquid in the body to absorb heat from the heat source and another end disposed outside the envelope to dissipate heat.
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Parsapour, H.B., “Convection Cooling in Small Terminals,” IBM Technical Disclosure Bulletin, vol. 24, No. 2, Jul. 1981.
Chan Weng Kong
Choo Kok Fah
Liu Chang Yu
Tou Kwok Woon
Wong Yew Wah
Atkinson Christopher
DSO National Laboratories
Stoel Rives LLP
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