Heat sink

Details Heat sink Heat sink

1999-04-16

2001-06-12

Tolin, Gerald (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C024S458000, C248S510000, C257S727000, C361S703000

Reexamination Certificate

active

06246584

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention generally relates to a heat sink for removing heat from an electronic device, such as a central processing unit (CPU), and in particular to a heat sink having a simple and universal structure which is suitable for removing heat from different electronic devices.
2. The Prior Art
The operation of electronic devices, such as a central processing unit (CPU), adapted in a computer generates heat. With the significant increase in the operational speed of electronic devices, the heat generated during operation of the electronic device becomes substantial which, if not properly removed, leads to the overheating of the electronic device. A heat sink is usually attached to the electronic device to remove the heat generated thereby. There are a variety of heat sinks available in the market.
FIGS. 1 and 2
of the attached drawings show two conventional heat sinks.
The heat sink
1
of
FIG. 1
comprises a base
10
on which a plurality of parallel and spaced fins
14
are formed. The base
10
has two lugs
11
each forming a hole
111
for receiving a fastener
12
therein. A spring
13
is associated with each of the fasteners
12
to provide a biasing force for urging the base
10
of the heat sink
1
against an electronic device from which heat is to be removed thereby establishing a secure contact engagement therebetween. However, the formation of the lugs
11
on the base
10
not only complicates the manufacturing process of the heat sink, but also creates material waste during formation of the lugs
11
.
The heat sink
20
of
FIG. 2
comprises a base
25
positionable on an electronic device
2
, such as a CPU, and a plurality of fins
26
formed on the base
25
. A planar section
21
is machined on the base
25
among the fins
26
for receiving a resilient clip
22
which engages with sideways projections
24
of a CPU socket
23
thereby securing the heat sink
20
to the CPU
2
mounted on the CPU socket
23
. Such a heat sink
20
is disclosed in U.S. Pat. No. 5,671,118. However, the formation of a planar section on the heat sink increases costs and may damage the heat sink.
It is thus desirable to have a heat sink with a simple structure for facilitating and reducing manufacturing costs.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a heat sink having a simple and universal structure.
Another object of the present invention is to provide a heat sink having a simple structure for simplifying the manufacture thereof.
A further object of the present invention is to provide a heat sink that has a low manufacturing cost.
Yet another object of the present invention is to provide a heat sink which can be readily mounted to an electronic device from which heat is to be removed.
To achieve the above objects, a heat sink in accordance with the present invention comprises a thermally conductive body and at least one clip to secure the conductive body to a circuit board with a central processing unit interposed between the heat sink and the circuit board. The conductive body has a base with a flat bottom face positioned on the central processing unit and a top side on which a plurality of fins are formed. The fins are parallel with and spaced from each other to define slots therebetween which serve as air flow passages. The conductive body is made by means of extrusion whereby the fins and the base are integrated with each other as a unitary member. The clip has a U-shaped anchoring section fit into one of the slots and retained by the adjacent fins, and a cantilevered arm extending from the anchoring section and having a free end. The free end defines a hole for receiving a fastener to secure the clip to the circuit board. The clip is stamped to be a unitary member. Thus, the manufacture of the heat sink is greatly simplified.


REFERENCES:
patent: 5541811 (1996-07-01), Henningsson
patent: 5594624 (1997-01-01), Clemens
patent: 5771153 (1998-06-01), Sheng
patent: 5818695 (1998-10-01), Olson
patent: 5831829 (1998-11-01), Lin
patent: 5870288 (1999-02-01), Chen
patent: 5982620 (1999-11-01), Lin
patent: 6037660 (2000-03-01), Liu

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