Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1994-05-27
1996-10-22
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257722, 257706, H01L 2310, H01L 2334
Patent
active
055679862
ABSTRACT:
A heat sink is provided wherein a heat receiving plate and at least one piece of heat radiating fin are stacked in the heat sink, and an interval between the heat receiving plate and fin is maintained by a number of bosses geometrically disposed on the heat radiating fin. The bottom of each boss is soldered onto the adjacent heat receiving plate or heat radiating fin. The heat sink therefore is provided with a plurality of conductive contacts between said fins and said heat receiving plate in the radial or transverse direction.
REFERENCES:
patent: 4421161 (1983-12-01), Romania et al.
Clark S. V.
Crane Sara W.
Diamond Electric Mfg. Co. Ltd.
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