Heat sink

Heat exchange – With retainer for removable article – Electrical component

Patent

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Details

165185, 357 81, 361383, H01L 7302

Patent

active

048025321

ABSTRACT:
Low thermal resistance coupling is provided between electronic components and a main heat sink by the expedient of providing individual, adjustable height pillars between them. The pillars (7) comprise a bifurcated body and a detachable head 10. The head is attached to the hot component by means of silver loaded epoxy (8). The height of the pillar may subsequently be adjusted, the component (2) attached to a circuit board, and the pillar secured by establishing an interference fit between the pillar 7 and the walls of its mounting hole. Thermal resistances of less than 6.5.degree. C/W are achieved between a semiconductor junction and a heat sink coupled in this way.

REFERENCES:
patent: 3435891 (1969-04-01), Parrish
patent: 3476177 (1969-11-01), Potzl
patent: 4046442 (1977-09-01), Hutchinson
patent: 4293175 (1981-10-01), Cutchaw
patent: 4607685 (1986-08-01), Mitchell, Jr.
patent: 4685211 (1987-08-01), Hagihara et al.

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