Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-08-07
2007-08-07
Vortman, Anatoly (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S711000
Reexamination Certificate
active
10866790
ABSTRACT:
A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in cooperation with the base member (1) a passage through which the coolant flows, and a bellows-like flow straightening plate (6) disposed between the power semiconductor module (5) and the base member (1) in physical contact with the power semiconductor module (5) on one hand and with the base member (1) on the other hand. The flow straightening plate (6) partitions the passage into a plurality of flow straightening channels (14A,14B).
REFERENCES:
patent: 4415025 (1983-11-01), Horvath
patent: 5006924 (1991-04-01), Frankeny et al.
patent: 5358032 (1994-10-01), Arai et al.
patent: 5884691 (1999-03-01), Batchelder
patent: 6401807 (2002-06-01), Wyler et al.
patent: 6466438 (2002-10-01), Lim
patent: 6765793 (2004-07-01), Kehret et al.
patent: 6798663 (2004-09-01), Rubenstein
patent: 6992382 (2006-01-01), Chrysler et al.
patent: 7017655 (2006-03-01), Wilson et al.
patent: 7044199 (2006-05-01), Thayer et al.
patent: 2001/0033476 (2001-10-01), Dibene et al.
patent: 2005/0017350 (2005-01-01), Corti et al.
patent: 63-97292 (1988-06-01), None
patent: 6-275746 (1994-09-01), None
patent: 8-111480 (1996-04-01), None
patent: 2001-257296 (2001-09-01), None
patent: 2002-235876 (2002-08-01), None
patent: 2002-324884 (2002-11-01), None
Chiba Hiroshi
Ogushi Tetsuro
Yamabuchi Hiroshi
Yamada Akira
Mitsubishi Denki & Kabushiki Kaisha
Sughrue & Mion, PLLC
Vortman Anatoly
LandOfFree
Heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3828167