Heat sink

Details Heat sink Heat sink

2006-01-31

2006-01-31

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S695000, C361S699000, C257S715000, C174S015200, C165S080400, C165S104260

Reexamination Certificate

active

06992890

ABSTRACT:
A heat sink is provided. The heat sink comprises a hollow chassis having a contact face at a bottom portion thereof for attaching to an electronic component and a heat dissipating face at a top portion thereof. A plurality of circularly arranged fins extend from an inner sidewall of the hollow chassis towards a center of the hollow chassis so that gaps between the fins gradually decrease from the inner sidewall of said hollow chassis towards the center of said hollow chassis. At least a heat pipe is positioned between the contact face and the heat dissipating face. At least a fan is positioned at a side of the hollow chassis for generating air to increase an amount of air blowing through wider gaps between said fins to increase the speed of heat dissipation.

REFERENCES:
patent: 5529115 (1996-06-01), Paterson
patent: 6315033 (2001-11-01), Li
patent: 6439298 (2002-08-01), Li
patent: 6702002 (2004-03-01), Wang
patent: 2003/0196778 (2003-10-01), Kobayashi et al.
patent: 2004/0226690 (2004-11-01), Lee et al.

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