Heat sink

Details Heat sink Heat sink

2005-12-06

2005-12-06

Jones, Melvin (Department: 3744)

Refrigeration

Using electrical or magnetic effect

Thermoelectric; e.g., peltier effect

C062S259200

Reexamination Certificate

active

06971243

ABSTRACT:
A heat sink is described for extracting heat from at least one electronic device, such as a microprocessor, either directly or indirectly (i.e. via liquid coolant). The heat sink includes a first thermal plate, a second thermal plate and a plurality of fins integral with and extending between both the first thermal plate and the second thermal plate.

REFERENCES:
patent: 5020586 (1991-06-01), Mansingh
patent: 5072787 (1991-12-01), Nakamichi et al.
patent: 5381859 (1995-01-01), Minakami et al.
patent: 5457342 (1995-10-01), Herbst, II
patent: 5509465 (1996-04-01), Lai
patent: 5947192 (1999-09-01), Kuo
patent: 5964285 (1999-10-01), Huang
patent: 5988266 (1999-11-01), Smith et al.
patent: 6062301 (2000-05-01), Lu
patent: D426196 (2000-06-01), Lee
patent: D426814 (2000-06-01), Lee
patent: 6138352 (2000-10-01), Smith et al.
patent: 6199627 (2001-03-01), Wang
patent: 6223815 (2001-05-01), Shibasaki
patent: 6269003 (2001-07-01), Wen-Chen
patent: 6310771 (2001-10-01), Chien
patent: 6330906 (2001-12-01), Wang
patent: 6341490 (2002-01-01), Jones
patent: D458232 (2002-06-01), Lee
patent: 6404632 (2002-06-01), Forkas
patent: 6424533 (2002-07-01), Chu et al.
patent: 6446442 (2002-09-01), Batchelor et al.
patent: 6604575 (2003-08-01), Degtiarenko
patent: 6619044 (2003-09-01), Batchelor et al.
patent: 2002/0043360 (2002-04-01), Lee
patent: 2002/0121358 (2002-09-01), Lee
patent: 198 41 583 (2000-03-01), None
patent: 2 059 569 (1981-04-01), None
patent: 57 188855 (1983-02-01), None
patent: 2003 069266 (2003-07-01), None
patent: WO 03/007372 (2003-01-01), None

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