Special receptacle or package – Article housing attached to panel – Housing contoured to retain article
Patent
1979-05-07
1981-02-10
Moorhead, Davis T.
Special receptacle or package
Article housing attached to panel
Housing contoured to retain article
229DIG12, B65D 6504, B65D 8500
Patent
active
042496594
ABSTRACT:
A package and a method of producing a package by forming a pocket in the central portion of a sheet of wrapping material, preferably a thermoplastic film, placing a product within the pocket, folding the flat portions of the film into face-to-face contact and bonding the flat portions together. The package can also be evacuated and hermetically sealed. If the film has been oriented, the pocket may be heat shrunk.
REFERENCES:
patent: 3127993 (1964-04-01), Phipps
patent: 3516537 (1970-06-01), Dreyfus et al.
patent: 3679048 (1972-07-01), Fujio
patent: 3776375 (1973-12-01), Rohdin
patent: 3863837 (1975-02-01), Spiegel et al.
Harps Joseph P.
Lee, Jr. William D.
Moorhead Davis T.
Toney John J.
W. R. Grace & Co.
LandOfFree
Heat shrunk package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat shrunk package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat shrunk package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1661951