Heat-shrinkable multi-layer film

Details Heat-shrinkable multi-layer film Heat-shrinkable multi-layer film

1997-05-28

2000-11-14

Lipman, Bernard

Stock material or miscellaneous articles

Hollow or container type article

Polymer or resin containing

428 349, 428 367, 428483, 4284758, 428518, B29D 2200

Patent

active

06146726&

ABSTRACT:
The invention provides a heat-shrinkable multi-layer film comprising at least a thermoplastic resin layer as the outermost layer (A), a gas barrier resin layer as a core layer (B) and a sealing resin layer as the innermost layer (C), and optionally an adhesive layer between the individual layers, wherein (1) the sealing resin layer of the innermost layer (C) is a layer formed of a resin material (b) comprising a linear ethylene-1-octene copolymer (a) obtained by using a constrained geometry catalyst and having an 1-octene content not lower than 1 wt. % but lower than 20 wt. % and a density higher than 0.885 g/cm.sup.3 but not higher than 0.960 g/cm.sup.3, and (2) an intermediate layer (D1) formed of at least one resin (c) selected from the group consisting of polyamide resins, thermoplastic polyester resins and ethylene copolymer resins is provided between the outermost layer (A) and the core layer (B). The film has excellent sealing properties, clarity, mechanical strength, stretchability and bag-making property.

REFERENCES:
patent: 5272236 (1993-12-01), Lei et al.
patent: 5427807 (1995-06-01), Chum et al.
patent: 5525695 (1996-06-01), Lei et al.
patent: 5562958 (1996-10-01), Walton et al.
patent: 5604043 (1997-02-01), Ahlgren
patent: 5629059 (1997-05-01), Desai et al.

Affiliated with

Also associated with

Rating

Heat-shrinkable multi-layer film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-shrinkable multi-layer film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-shrinkable multi-layer film will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2063016