Heat-shrinkable banding apparatus and method

Details Heat-shrinkable banding apparatus and method Heat-shrinkable banding apparatus and method

2007-04-17

2007-04-17

Gray, Linda (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S085000, C156S086000, C156S556000, C156SDIG014, C156SDIG012, C156SDIG026, C053S292000, C053S399000

Reexamination Certificate

active

11471769

ABSTRACT:
An apparatus and method is provided for forming a sleeve from a flat tube and applying the sleeve to a container. A length of flat tube is advanced from a supply to a position between a pair of movable grippers. The grippers are extended to contact and hold the tube, and a cutter severs the length of flat tube from the supply. A vacuum is applied to the grippers, and the grippers are retracted to open the cut flat tube into a round configuration. A second length of flat tube is advanced, pushing the open cut length tube onto a container that is being moved therebeneath on a conveyor.

REFERENCES:
patent: 3888067 (1975-06-01), Cross et al.
patent: 4387553 (1983-06-01), Strub et al.
patent: 4914893 (1990-04-01), Strub et al.
patent: 5006196 (1991-04-01), Vandevoorde
patent: 5024049 (1991-06-01), Strub et al.
patent: 5060367 (1991-10-01), Vandevoorde
patent: 5305578 (1994-04-01), Menayan
patent: 5433057 (1995-07-01), Lerner et al.
patent: 6474390 (2002-11-01), Vandevoorde
patent: 6543514 (2003-04-01), Menayan
patent: 2002/0096262 (2002-07-01), Yang
patent: 2003/0192639 (2003-10-01), Mitchell et al.

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