Package making – Methods – Applying a partial cover
Patent
1993-03-15
1994-04-26
Sipos, John
Package making
Methods
Applying a partial cover
53292, 53567, 53585, B65B 910
Patent
active
053055780
ABSTRACT:
A band application machine for transferring to containers heat-shrinkable bands. The band application machine includes a band feed system for feeding band supply material to a cutting system which cuts a band from the band supply. A transfer system transfers cut bands to containers conveyed past a banding point, and includes a band gripping mechanism and a plunger. Band gripping mechanism includes opposed suction cups that are movably mounted for gripping and positioning a cut band. The suction cups are laterally movable from a position where a closed band is gripped on opposing sides by the suction cups to a position where the band is open and aligned with the stroke of the plunger. The plunger is positioned over the opened band at an angle with respect to the band. The plunger presses and drives the band onto a container as the gripper apparatus releases the open band. The angle of the top plunger with respect to the cut band results in the plunger engaging a leading edge of the cut band as the plunger moves to press the band onto the underpassing container. Associated with the plunger are air blast openings that direct air against an inside, trailing section of the band so as to effectively urge and maintain the band in an open position as the plunger presses the band onto the container. A programmable control system directs the operation of the band application machine.
REFERENCES:
patent: 2976661 (1961-03-01), Bagnelle
patent: 3888067 (1975-06-01), Cross et al.
patent: 4184309 (1980-01-01), Amberg
patent: 4293364 (1981-10-01), Fujio
patent: 4914893 (1990-04-01), Strub et al.
patent: 5070680 (1991-12-01), Nagano
patent: 5101613 (1992-04-01), Wilhelm et al.
Axon Corporation
Johnson Linda B.
Sipos John
LandOfFree
Heat-shrinkable band application machine does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat-shrinkable band application machine, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-shrinkable band application machine will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1704110