Heat-sensitive transferring medium of delayed sending type

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

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Details

156238, 156240, 156277, 427256, 428195, 428484, 4284884, 428500, 428521, 428522, 428913, 428914, B41M 526

Patent

active

049484460

ABSTRACT:
A heat-sensitive transferring medium of a delayed sending type comprises a heat-melting ink layer and an over-coating layer overlying said ink layer and mainly composed of resin and/or wax.

REFERENCES:
patent: 4500896 (1985-02-01), Kubo et al.
patent: 4518645 (1985-08-01), Moriguchi et al.

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