Heat-sensitive transfer material

Details Heat-sensitive transfer material Heat-sensitive transfer material

1989-03-02

1989-10-31

Robinson, Ellis P.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

428195, 4284111, 428484, 4284881, 428913, 428914, B41M 526

Patent

active

048776815

ABSTRACT:
This invention provides a heat-sensitive transfer layer which comprises a substrate and a heat-melting ink layer provided to one surface of said substrate, characterized by providing, between said substrate and heat-melting ink layer, an interlayer which breaks away within itself by separation under heat at the time of heat transfer.

REFERENCES:
patent: 4681796 (1987-07-01), Maehashi et al.
patent: 4708903 (1987-11-01), Tanaka et al.

Affiliated with

Also associated with

Rating

Heat-sensitive transfer material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-sensitive transfer material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-sensitive transfer material will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-625142