Heat-sensitive transfer material

Details Heat-sensitive transfer material Heat-sensitive transfer material

1989-02-02

1990-05-15

Schwartz, Pamela R.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

428195, 428212, 428484, 4284881, 4284884, 428913, 428914, B32B 904

Patent

active

049257315

ABSTRACT:
This invention provides a heat-sensitive transfer layer which comprises a substrate and a heat-melting ink layer provided to one surface of said substrate, characterized by providing, between said substrate and heat-melting ink layer, an interlayer which breaks away within itself by separation under heat at the time of heat transfer.

REFERENCES:
patent: 4681796 (1987-07-01), Maehashi et al.
patent: 4708903 (1987-11-01), Tanaka et al.
patent: 4818591 (1989-04-01), Kitamura et al.

Affiliated with

Also associated with

Rating

Heat-sensitive transfer material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-sensitive transfer material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-sensitive transfer material will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-620940