Heat-sensitive transfer material

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Details

428195, 428484, 4284881, 4284884, 428500, 428522, 428913, 428914, B41M 526

Patent

active

050594788

DESCRIPTION:

BRIEF SUMMARY
FIELD OF THE INVENTION

This invention relates to a heat-sensitive transfer material for multi-use purpose. More specifically, it relates to a heat-sensitive transfer material which shows a low decrease in density and a high sensitivity after multi-uses, maintains high density and is excellent in resolution.


DESCRIPTION OF RELATED ART

In a heat-sensitive transfer material simply comprising a heat-melting ink layer on a substrate film, the ink is entirely transferred to a recording material in one transfer. Therefore, such a transfer material is disadvantageous in economy since it has to be thrown away after only one use. There are therefore many proposals of heatsensitive transfer materials which permit multiple uses by improving the defects of heat-transfer materials of such a conventional type.
For example, Japanese Laid-Open Patent Publication No. 105579/1980 discloses a multi-use heat-sensitive transfer material having, on its substrate film, an ink layer of porous net-like structure in which a heat-melting ink is filled. In this technique, however, the amount of ink filed in the ink layer is limited. Hence, its defect is that repeated transfer causes a rapid decrease in printing density, and the number of transfers in repetition is limited.
Japanese Laid-Open patent Publications Nos. 40293/1985, 1574/1987, 73994/1987 or the like also disclose a heat-sensitive transfer material formed by laminating a heatmelting ink layer and a transfer control layer on a substrate film. The technique of these Publications is to control the amount of an ink transferred in one operation by means of a microporous layer formed on the surface of the material. Thus, the technique has characteristics that the decrease in density by repetition of transfers can be reduced and the multi-transfers can be carried out while maintaining the same printing quality. However, in such heat-sensitive transfer materials, the heat-melting ink layer and the substrate film separate from each other in the interface depending upon transfer conditions, or the heat-sensitive transfer materials are destroyed. That is, there is a problem that the multi-use thereof for transfer is not possible. Especially, this tendency appears markedly in the case of so-called solid pattern printing, i.e., printing by spreading an ink wholly over on the surface or in rectangular areas. The tendency also appears depending upon heat-sensitive transfer devices, and particularly, this problem tends to occur often in the case of using thermal printers of dotted-line type such as printers for computers.
It is an object of this invention to provide a heatsensitive transfer material which exhibits a smaller decrease in density in multi-transfers and permits stable repeated thermal transfers regardless of the method of use.


SUMMARY OF THE INVENTION

This invention provides a heat-sensitive transfer material formed by providing one surface of a substrate film with a heat-melting ink layer through an adhesive layer and providing a transfer control layer onto said heat-melting ink layer. By providing the adhesive layer to firmly bond the substrate film and the heat-melting ink layer, this invention makes it possible to prevent the failure in multi-transfers caused by transfer of the heat-melting ink layer and the transfer control layer at one time due to separation in the interface between the substrate film and the heat-melting ink layer in printing, and this invention also makes it possible to suitably control the amount of ink to be transferred through the transfer control layer. Accordingly, it is made possible to provide a heat-sensitive transfer material which does not cause a decrease in the density of transferred objects even if the heat-sensitive multi-transfers are carried out.


BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 to 3 are partially magnified cross-sectional views of the heat-sensitive transfer material of the present invention.


DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will be explained according to the drawings.
FIGS. 1 to 3 ar

REFERENCES:
patent: 4518645 (1985-05-01), Moriguchi et al.
patent: 4707406 (1987-11-01), Inaba et al.
patent: 4774128 (1988-09-01), Koshizuka et al.
patent: 4865913 (1989-09-01), Takeuchi et al.

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