Heat-sensitive stencil, process of fabricating same and method o

Details Heat-sensitive stencil, process of fabricating same and method o Heat-sensitive stencil, process of fabricating same and method o

1999-12-22

2000-07-25

Funk, Stephen R.

Printing

Stenciling

Stencils

427273, 427335, 427336, B41C 114, B32B 518

Patent

active

060924616

ABSTRACT:
A heat-sensitive stencil including a porous support, and a thermoplastic resin film laminated on the support and having a surface smoothness of at least 10,000 seconds. The stencil is fabricated by bonding a thermoplastic resin film to a porous support with an adhesive having a specific viscosity and a specific volatile matter content, while maintaining each of the support and the film under a specific tension. The stencil may also be fabricated by applying a coating composition containing a resin and first and second solvents having a specific solubility and specific evaporation rates, and drying the applied composition to form a porous support. A printing master is produced by heating the above stencil imagewise by a thermal head with a heating energy of not greater than 0.05 mJ/dot.

REFERENCES:
patent: 5447899 (1995-09-01), Matoba et al.
patent: 5843560 (1998-12-01), Ohta et al.
patent: 5924360 (1999-07-01), Adachi et al.

Affiliated with

Also associated with

Rating

Heat-sensitive stencil, process of fabricating same and method o does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-sensitive stencil, process of fabricating same and method o, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-sensitive stencil, process of fabricating same and method o will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1329202