Heat-sensitive stencil, method of preparing stencil printing...

Details Heat-sensitive stencil, method of preparing stencil printing... Heat-sensitive stencil, method of preparing stencil printing...

2007-08-07

2007-08-07

Chang, Victor S. (Department: 1771)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

C428S215000, C428S314200, C428S317900, C428S319700, C427S143000, C427S208800, C442S287000, C442S395000

Reexamination Certificate

active

09945764

ABSTRACT:
A heat-sensitive stencil including a thermoplastic resin film on which a porous resin layer and a porous reinforcing layer are formed in succession. A porous fibrous layer may be disposed between the porous resin layer and the porous reinforcing layer.

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patent: 6025286 (2000-02-01), Kawatsu et al.
patent: 6096374 (2000-08-01), Ohta et al.
patent: 10-24667 (1998-01-01), None
patent: 10147075 (1998-06-01), None
patent: 10236011 (1998-09-01), None
patent: 2000171252 (2001-06-01), None
English translation of JP 10-147075.
U.S. Appl. No. 09/204,603, filed Dec. 3, 1998.
U.S. Appl. No. 09/679,747, filed Jan. 5, 2000.

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