Heat sensitive stencil having a porous substrate with tightly bo

Details Heat sensitive stencil having a porous substrate with tightly bo Heat sensitive stencil having a porous substrate with tightly bo

1997-10-14

1999-03-02

Funk, Stephen R.

Printing

Stenciling

Stencils

428195, B41N 124

Patent

active

058757112

ABSTRACT:
A heat-sensitive stencil is disclosed which includes a porous substrate having opposing first and second surfaces, and a thermoplastic resin film bonded to the first surface of the substrate with an adhesive, wherein the second surface of the substrate is negative to a wax No. 6 pick test defined in the specification herein so that the fibers constituting the substrate are not picked off during its contact with a platen roller in the master forming stage.

REFERENCES:
patent: 5091257 (1992-02-01), Nonogaki et al.

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