Heat-sensitive stencil and method of fabricating same

Details Heat-sensitive stencil and method of fabricating same Heat-sensitive stencil and method of fabricating same

1996-10-30

1998-12-01

Watkins, III, William P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

428138, 428220, 4283148, 4283179, 428195, 10112821, B05C 1706, B32B 324

Patent

active

058435603

ABSTRACT:
A heat-sensitive stencil having a thermoplastic resin film, and a porous resin layer formed thereon. The stencil has an air permeability in the range of 1.0 cm.sup.3 /cm.sup.2 .multidot.sec to 157 cm.sup.3 /cm.sup.2 .multidot.sec in a portion thereof when the thermoplastic resin film of the portion is perforated to form perforations providing an open ratio S.sub.O /S.sub.P of at least 0.2, wherein S.sub.O represents a total area of the perforations and S.sub.P represents the area of the portion. The heat-sensitive stencil is prepared by applying a coating liquid containing the resin of the porous resin layer to the thermoplastic resin film and drying the coating. The coating liquid contains a mixture of a good solvent and a poor solvent less vaporizable than the good solvent so that the porous resin layer is formed after drying.

REFERENCES:
patent: 4091727 (1978-05-01), Hasegawa et al.
patent: 4957808 (1990-09-01), Arai et al.
patent: 5091257 (1992-02-01), Nonogaki et al.
patent: 5188881 (1993-02-01), Sugiyama et al.
patent: 5198407 (1993-03-01), Motegi et al.
patent: 5417156 (1995-05-01), Tateishi et al.
patent: 5621452 (1997-04-01), Okumura
patent: 5662040 (1997-09-01), Mori et al.

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