Radiation imagery chemistry: process – composition – or product th – Microcapsule – process – composition – or product
Patent
1997-05-21
1999-02-02
Chu, John S.
Radiation imagery chemistry: process, composition, or product th
Microcapsule, process, composition, or product
430156, 430157, 430171, 430182, G03C 158, G03F 7016
Patent
active
058662936
ABSTRACT:
A heat-sensitive recording material having excellent light-fastness and raw stock storability is disclosed. The material includes a support and a heat-sensitive recording layer provided on the support, and the heat-sensitive recording layer contains a diazo compound and a coupler. The coupler contains at least one species of pyrazolone compounds represented by the following formula (1): ##STR1## wherein Ar represents a phenyl group, a naphthyl group, or an aromatic heterocyclic group, any one of which may have a substituent bonded to the nucleus, said substituent may be a halogen atom, a cyano group, a trifluoromethyl group, an alkyl group, an aryl group, an alkoxycarbonyl group, a carbamoyl group, or a sulfamoyl group; R.sup.1 and R.sup.2 independently represent an alkyl group, an alkenyl group, or an aryl group, or R.sup.1 and R.sup.2 may be linked to each other so as to form a heterocycle.
REFERENCES:
patent: 2536398 (1951-01-01), Slifkin
patent: 2537098 (1951-06-01), Slifkin et al.
patent: 3910794 (1975-10-01), Buisine et al.
patent: 4348528 (1982-09-01), Breda et al.
patent: 4460048 (1984-07-01), Kurihara et al.
patent: 4644376 (1987-02-01), Usami et al.
patent: 5213939 (1993-05-01), Sugiyama et al.
patent: 5407777 (1995-04-01), Shimada et al.
Matsushita Tetsunori
Nomura Kimiatsu
Sano Shojiro
Sato Hiroshi
Yanagihara Naoto
Chu John S.
Fuji Photo Film Co. , Ltd.
LandOfFree
Heat-sensitive recording material does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat-sensitive recording material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-sensitive recording material will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1115706