Heat-sensitive recording head and method of manufacturing same

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

427 531, 427 58, 427289, 427402, 219216, 338308, 338309, 430311, 346 76PH, G01D 1510, B05D 512, H05B 300

Patent

active

047388714

ABSTRACT:
The first and second electrodes, to which a recording signal is to be applied, are printed to a desired pattern on an insulating substrate by, for example, a screen printing method. A heating resistor is formed by, for example, a screen printing method so as to be bridged over these first and second electrodes. A protective layer is formed so as to cover the first and second electrodes and heating resistor therewith. Each of the heating portions of the heating resistor is provided with one or a plurality of laser-made holes, and the resistance value of each heating portion of the heating resistor is regulated to a predetermined level on the basis of the number of the laser-made holes.

REFERENCES:
patent: 3099540 (1963-07-01), Eisler
patent: 4105892 (1978-08-01), Tashiro et al.
patent: 4160897 (1979-07-01), Marino
patent: 4204107 (1980-05-01), Ohkubo et al.
patent: 4472875 (1984-09-01), Christian et al.

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