Heat-sensitive pressure-sensitive adhesive and...

Stock material or miscellaneous articles – Structurally defined web or sheet – Including components having same physical characteristic in...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C428S220000, C428S323000, C428S341000, C428S349000, C524S147000, C524S154000

Reexamination Certificate

active

07993732

ABSTRACT:
A heat-sensitive pressure-sensitive adhesive which contains at least a thermoplastic resin and a thermofusible material, wherein the thermoplastic resin has a glass transition temperature of −70° C. to −30° C., and the thermofusible material comprises triphenylphosphine, and at least any one of tris(2,4-di-t-butylphenyl)phosphite and tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate]methane, or a heat-sensitive pressure-sensitive adhesive which contains at least a thermoplastic resin, a thermofusible material and a non-thermofusible material, wherein the thermofusible material contains triphenylphosphine.

REFERENCES:
patent: 4732961 (1988-03-01), Oka
patent: 5180627 (1993-01-01), Inoue et al.
patent: 6503620 (2003-01-01), Xie et al.
patent: 7262514 (2007-08-01), Yoshikawa et al.
patent: 2001/0018986 (2001-09-01), Nagai et al.
patent: 2003/0236362 (2003-12-01), Bluem et al.
patent: 2004/0265573 (2004-12-01), Morita et al.
patent: 2006/0068191 (2006-03-01), Goto et al.
patent: 2007/0112113 (2007-05-01), Yamaguchi et al.
patent: 1634936 (2006-03-01), None
patent: 61-9479 (1986-01-01), None
patent: 6-57226 (1994-03-01), None
patent: 6-57233 (1994-03-01), None
patent: 6-25869 (1994-04-01), None
patent: 7-278521 (1995-10-01), None
patent: 2683733 (1997-08-01), None
patent: 9-235528 (1997-09-01), None
patent: 9-265260 (1997-10-01), None
patent: 10-152660 (1998-06-01), None
patent: 11-279495 (1999-10-01), None
patent: 2000-103969 (2000-04-01), None
patent: 2000-191920 (2000-07-01), None
patent: 2000-191922 (2000-07-01), None
patent: 2000-212527 (2000-08-01), None
patent: 2001-64401 (2001-03-01), None
patent: 2002-146303 (2001-05-01), None
patent: 2001-234151 (2001-08-01), None
patent: 2001-262117 (2001-09-01), None
patent: 2002-38123 (2002-02-01), None
patent: 2002-88678 (2002-03-01), None
patent: 2002-114953 (2002-04-01), None
patent: 2002-173662 (2002-06-01), None
patent: 2002-338935 (2002-11-01), None
patent: 2004-117941 (2004-04-01), None
patent: 3556414 (2004-05-01), None
patent: 2006-111865 (2006-04-01), None
patent: 3922688 (2007-03-01), None
patent: WO 01/32796 (2001-05-01), None
European search report dated Nov. 7, 2007 in connection with corresponding European Patent Application No. 07 11 3344.
Apr. 20, 2010 European Search Report in connection with counterpart European patent application No. EP 07113344.
Hans-Georg Elias (1990), “Makromoleküle Band 1 Grundlagen,” Hüthig & Wepf Verlag, Basel Heidelberg, New York, ISBN: 3-85739-101-4, pp. 845-857.
“Handbook of Adhesives”, 12thEd., Kobunshi Kankokai (1980), pp. 131-135 (including partial English translation).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat-sensitive pressure-sensitive adhesive and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-sensitive pressure-sensitive adhesive and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-sensitive pressure-sensitive adhesive and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2717547

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.