Heat sensitive electronic component

Details Heat sensitive electronic component Heat sensitive electronic component

1995-02-10

1995-10-24

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrolytic systems or devices

Solid electrolytic capacitor

174 522, 257729, 257788, 340691, 361719, 361773, 3612754, H01G 906

Patent

active

054615399

ABSTRACT:
An electronic component is provided which comprises a resin package for enclosing inside parts. The package has a heat sensitive surface portion provided with a heat sensitive material which irreversibly discolors at a temperature higher than the soldering temperature for the electronic component. The component may be a solid tantalum capacitor, solid aluminum capacitor, diode or transistor which generates heat under abnormal operating conditions.

REFERENCES:
patent: 3653959 (1972-04-01), Kehr
patent: 4225659 (1980-09-01), Drexler
patent: 4358955 (1982-11-01), Rait
patent: 4424990 (1984-01-01), White
patent: 4745457 (1988-05-01), Morgan
patent: 4786773 (1988-11-01), Keefer
patent: 4922242 (1990-05-01), Parker
patent: 4985751 (1991-01-01), Shiobara
patent: 5068062 (1991-11-01), Inata
patent: 5128616 (1992-07-01), Palmer
patent: 5216584 (1993-06-01), Okazaki
Handbook of Microelectronics Packaging and Interconnection Technologies, Electrochemical Publ. Ltd., 1985, pp. 54-55.

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