Heat-sensitive diazo recording material with diphenyl alkene cou

Details Heat-sensitive diazo recording material with diphenyl alkene cou Heat-sensitive diazo recording material with diphenyl alkene cou

1986-11-07

1988-09-13

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Diazo reproduction, process, composition, or product

Composition or product which contains radiation sensitive...

430138, 430151, 430182, 503214, 503218, G03C 158, B41M 518

Patent

active

047709731

ABSTRACT:
In a heat-sensitive recording material which comprises a substrate and a heat-sensitive recording layer thereon containing a diazonium salt and coupler compound, the heat-sensitive recording material characterized in that the coupler compound comprises at least one compound represented by the formula [I] below ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.6, R.sub.7 and R.sub.8 are each hydrogen atom, halogen atom, alkyl or alkoxyl; R.sub.9 is hydrogen atom or alkyl; X and Y are each hydrogen atom, --OR.sub.10 or --N(R.sub.11)(R.sub.12), R.sub.10, R.sub.11 and R.sub.12 being each hydrogen atom, alkyl, alicyclic group, aryl or aralkyl, these R.sub.10, R.sub.11 and R.sub.12 may have a substituent selected from among halogen atom, alkyl and alkoxy, R.sub.11 and R.sub.12 may link together to form a heteroring, or, one or both of R.sub.11 and R.sub.12 may form a heteroring together with an adjacent benzene ring; n is 0 or 1.

REFERENCES:
patent: 1966755 (1934-06-01), D'Hauterive
patent: 3533792 (1970-10-01), Petro et al.
patent: 3778274 (1973-12-01), Inove et al.
patent: 4142898 (1979-03-01), Izu
patent: 4486527 (1984-12-01), Kurisu et al.
patent: 4641160 (1987-02-01), Kondo et al.
patent: 4652512 (1987-03-01), Ishida et al.
Kosar, J., Light-Sensitive Systems, 1965, John Wiley and Sons, Inc., pp. 215, 219, 267 and 269.

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