Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Noninterengaged fiber-containing paper-free web or sheet...
Reexamination Certificate
2005-09-13
2010-10-12
Tarazano, D. Lawremce (Department: 1786)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Noninterengaged fiber-containing paper-free web or sheet...
C428S313300, C428S343000, C428S318400, C428S346000
Reexamination Certificate
active
07811661
ABSTRACT:
In order to provide heat-sensitive adhesive materials that represent high pressure-sensitive adhesive strength with respect to rough adherends such as cardboards or polyolefin wraps and lower decrease of adhesive strength with time, are thermally activated with lower energy and exhibit excellent blocking resistance, heat-sensitive adhesive materials are disclosed that contain a support, an underlayer, and a heat-sensitive adhesive layer, in this order, wherein the underlayer comprises a thermoplastic resin and a hollow filler, and the glass transition temperature of the thermoplastic resin is −70° C. or higher and below 0° C.
REFERENCES:
patent: 6696150 (2004-02-01), Ikeda et al.
patent: 6828017 (2004-12-01), Kugo et al.
patent: 7021214 (2006-04-01), Kugo et al.
patent: 2002/0064613 (2002-05-01), Kugo et al.
patent: 2003/0039917 (2003-02-01), Naruse et al.
patent: 2003/0175507 (2003-09-01), Ikeda et al.
patent: 2004/0043236 (2004-03-01), Kugo et al.
patent: 2004/0265573 (2004-12-01), Morita et al.
patent: 1243439 (2002-09-01), None
patent: 1327671 (2003-07-01), None
patent: 62-21835 (1987-05-01), None
patent: 6-57223 (1994-03-01), None
patent: 6-100847 (1994-04-01), None
patent: 6-100848 (1994-04-01), None
patent: 9-20079 (1997-01-01), None
patent: 10-35126 (1998-02-01), None
patent: 10-152660 (1998-06-01), None
patent: 11-65451 (1999-03-01), None
patent: 11-79152 (1999-03-01), None
patent: 11-157141 (1999-06-01), None
patent: 11-311945 (1999-11-01), None
patent: 2001-48139 (2001-02-01), None
patent: 2001-191643 (2001-07-01), None
patent: 2001-303036 (2001-10-01), None
patent: 2002-114954 (2002-04-01), None
patent: 2002-121532 (2002-04-01), None
patent: 2002-146303 (2002-05-01), None
patent: 2002-283717 (2002-10-01), None
patent: 2003-19862 (2003-01-01), None
Kobunshi Kankokai; “Handbook of Adhesives”, 12thEdition, p. 131-135 (1980).
Feb. 16, 2006 official Communication and European Search Report in corresponding European appln. No. EP 05 01 9905.
Database WPI, Section Ch, Week 199120; Derwent Publications, Ltd., London, GB; AN 1999-144012, XP002354335; Apr. 4, 1991.
Goto Hiroshi
Inaba Norihiko
Kitano Tohru
Kugo Tomoyuki
Morita Mitsunobu
Cooper & Dunham LLP
Ricoh & Company, Ltd.
Tarazano D. Lawremce
Thompson Camie S
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