Heat-sealable multi-layer film structures and methods of forming

Details Heat-sealable multi-layer film structures and methods of forming Heat-sealable multi-layer film structures and methods of forming

1985-01-24

1986-05-20

Buffalow, Edith

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428 35, 428347, 428516, 428910, B32B 2700

Patent

active

045901252

ABSTRACT:
Multi-layer structures, such as films of low coefficient of friction also having antistick characteristics over a wide temperature range during heat-sealing are disclosed. In accordance with a preferred embodiment, the films comprise an amide-containing polypropylene base layer and two heat sealable skin layers of a low stereoregularity polyolefin and microcrystalline wax. Methods for forming such structures are also disclosed.

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